Band zum Einschliessen von elektronischen Bauteilen.
摘要
<p>The present invention relates to a tape for encasing electronic parts. In conventional packages for encasing electronic parts, a film made of polyester resin is used as a cover tape. Peeling of the polyester cover tape from a carrier tape cannot be effected smoothly because the peeling adhesivity between the cover tape and the carrier tape is not uniform. This invention provides a tape for encasing electronic parts comprising a carrier tape having a plurality of recesses for encasing electronic parts and a plurality of guide perforations, and a cover tape pasted onto said carrier tape with an adhesive so as to seal only said recesses while leaving said guide perforations open. The cover tape is a nylon based resin sheet, and the adhesive is an ethylene-vinyl acetate copolymer-based adhesive. The cover tape can be pulled smoothly from the carrier tape during automatic assembly of circuit boards.</p>
申请公布号
DE68920231(D1)
申请公布日期
1995.02.09
申请号
DE1989620231
申请日期
1989.08.01
申请人
MINNESOTA MINING AND MFG. CO., SAINT PAUL, MINN., US
发明人
YAMASHITA, SHUNSUKE C/O MINNESOTA MINING AND, ST. PAUL MINNESOTA 55133-3427, US;KONDOH, NORIHITO C/O MINNESOTA MINING AND, ST. PAUL MINNESOTA 55133-3427, US