发明名称 |
Composite compact having a base of a hard-centered alloy in which the base is joined to a substrate through a joint layer and process for producing the same |
摘要 |
A composite compact component made of a composite compact consisting of a diamond or BN powder bonded to a hard sintered alloy base during a sintering operation, and a substrate composed of steel or a hard sintered alloy bonded to the base of the composite compact through a high strength filler metal or alloy having a melting point of at least the liquidus point of the hard sintered alloy base. A process of making set composite compact component is also disclosed as well as a drill bit containing said composite compact component and variations thereof.
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申请公布号 |
US4686080(A) |
申请公布日期 |
1987.08.11 |
申请号 |
US19850805590 |
申请日期 |
1985.12.09 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HARA, AKIRA;MIYAKE, MASAYA;YAZU, SHUJI |
分类号 |
B23B27/20;B23K31/02;B23K35/30;E21B10/54;E21B10/56;E21B10/567;(IPC1-7):B22F7/08 |
主分类号 |
B23B27/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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