发明名称 Composite compact having a base of a hard-centered alloy in which the base is joined to a substrate through a joint layer and process for producing the same
摘要 A composite compact component made of a composite compact consisting of a diamond or BN powder bonded to a hard sintered alloy base during a sintering operation, and a substrate composed of steel or a hard sintered alloy bonded to the base of the composite compact through a high strength filler metal or alloy having a melting point of at least the liquidus point of the hard sintered alloy base. A process of making set composite compact component is also disclosed as well as a drill bit containing said composite compact component and variations thereof.
申请公布号 US4686080(A) 申请公布日期 1987.08.11
申请号 US19850805590 申请日期 1985.12.09
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 HARA, AKIRA;MIYAKE, MASAYA;YAZU, SHUJI
分类号 B23B27/20;B23K31/02;B23K35/30;E21B10/54;E21B10/56;E21B10/567;(IPC1-7):B22F7/08 主分类号 B23B27/20
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