发明名称 HIGH THERMAL CONDUCTIVITY, MATCHED CTE, LOW DENSITY COMPOSITE
摘要 <p>The method and composite of the present invention has a significant advantage over known composites in the size of the diamond particles contained therein. Without a change in the diamond/metal ratio, the larger size diamond particles (about 110 microns and about 160 microns in size) provide a composite (20) of increased thermal conductivity without sacrificing CTE. Thus the CTE of the composite (20) may be matched with the CTE of the electrical components (18) with which it is associated and still retain the advantages of high conductivity. While exemplary embodiments of the present invention have been described, it is to be understood that the embodiments described are illustrative only and the scope of the invention is to be defined solely by the appended claims when accorded a full range of equivalence, many variations and modifications naturally occuring to those skilled in the art from a perusal hereof.</p>
申请公布号 WO1995004165(A1) 申请公布日期 1995.02.09
申请号 US1994008151 申请日期 1994.07.20
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