发明名称 Support element for an IC module
摘要 In the case of a support element (4) for an IC module (5) for the fitting into a card body (1), consisting of a substrate (7), on the surfaces of which a plurality of contact surfaces (9) are provided which are electrically conductively connected to the corresponding connection points (12) of the IC module (5) fastened on the substrate (7), the contact surfaces (9) turned towards the IC module (5) have prominences (11) of electrically conductive material which are opposite the connection points (12), and the IC module (5) is fastened by its contact points (12) onto the contact surfaces (9) with the aid of an electrically conductive adhesive (13). <IMAGE>
申请公布号 DE4325458(A1) 申请公布日期 1995.02.09
申请号 DE19934325458 申请日期 1993.07.29
申请人 ORGA BOND-TECHNIK GMBH, 33100 PADERBORN, DE 发明人 BLOME, RAINER, 33106 PADERBORN, DE;TRUEGGELMANN, UWE, 33098 PADERBORN, DE
分类号 G06K19/077;H01L23/498 主分类号 G06K19/077
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