发明名称 Backing layer for acoustic transducer array.
摘要 <p>The invention provides an acoustic transducer for transmitting acoustic wave energy in response to an electrical signal and for converting the received acoustic wave energy into an electric signal. The transducer includes an array of piezoelectric elements (52), a backing layer (30) attached at a rearward face of the piezoelectric elements, a circuit element (54) spaced apart from the piezoelectric elements (52) by the backing layer (30), and at least one electrical conductor (24) for each of the piezoelectric elements (52) to connect the elements to the circuit element (54). The backing layer (30) comprises a plurality of layers (10) of acoustic attenuating material integrally formed into a laminate structure. The electrical conductors (24) extend along a surface of each of the layers (10) and have a predetermined pitch. Each of the layers (10) has a thickness substantially equivalent to the pitch of the electrical conductors (24). Individual piezoelectric elements (52) are formed on the upper surface (32) of the laminate structure (30), and conductive pads (46) are formed on the lower surface (34) of the laminate structure. The electrical conductors (24) provide electrical connection through the backing layer (30) between the piezoelectric elements (52) and the associated conductive pads (46). &lt;IMAGE&gt;</p>
申请公布号 EP0637470(A2) 申请公布日期 1995.02.08
申请号 EP19940305729 申请日期 1994.08.02
申请人 HEWLETT-PACKARD COMPANY 发明人 GREENSTEIN, MICHAEL
分类号 A61B8/00;B06B1/06;H04R17/00;(IPC1-7):B06B1/06 主分类号 A61B8/00
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