发明名称 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics of the same.
摘要 <p>Disclosed herein is a multilayer electronic component (10) having one major surface (13) which can be widely utilized as a mounting surface for another electronic component to be composed with the same. A mother laminate (17) to be cut along a prescribed cutting line for obtaining a plurality of multilayer electronic components (10) is prepared, and a groove (18) is formed in the mother laminate (17) along the cutting line. External electrodes (15) are formed on side surfaces of the groove (18), and thereafter the mother laminate (17) is divided in the position of the groove (18), to obtain a plurality of multilayer electronic components (10) which are independent of each other. A number of multilayer electronic components (10) can be efficiently manufactured, while characteristics of the respective multilayer electronic components (10) can be efficiently measured in the state of the mother laminate (17). <IMAGE></p>
申请公布号 EP0637828(A2) 申请公布日期 1995.02.08
申请号 EP19940112042 申请日期 1994.08.02
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI, NORIO, C/O MURATA MANUFACTURING CO., LTD.;KUBOTA, KENJI, C/O MURATA MANUFACTURING CO., LTD.
分类号 H01F17/00;H01C1/14;H01G4/232;H01G4/30;H01L23/498;H05K1/03;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H01G4/232;H01L23/538 主分类号 H01F17/00
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