Rod shaped magnetron or sputter cathode arrangement, sputtering process, device for implementing the process and tube shaped target.

摘要

The invention relates to a bar-shaped magnetron-sputter cathode arrangement having an internal, cooled permanent magnet system and a carrier tube for the target. It is provided according to the invention that at least one thermal contact layer (38) is disposed between the carrier tube (36) and the target, which consists of one or more ring(s) (37, 37', 37'') shrunk, especially interchangeably, onto the carrier tube (36). During sputtering the cathode (6) and the surface to be sputtered can be subjected to a mutual relative motion in the longitudinal direction of the cathode (6), for which purpose an adjusting element is provided. The magnets (31) are disposed inside the carrier tube (36) with the magnetic fields having alternately opposing directions in the longitudinal direction of the carrier tube (36). They possess cylindrical or polygonal lateral surfaces and end faces (44) which are parallel and slope at an angle ( alpha ) to the longitudinal direction of the electrode (6) or shaft (30).