| 摘要 |
PURPOSE:To provide a MID chip type light emitting element which can be lessened in thermal stress when heat is applied and enhanced in reliability and wherein resin can be easily controlled in amount of filling in a manufacturing process, and color mixture can be set high in uniformity when LED chips are mounted. CONSTITUTION:Grooves 3 and 3' shallower than the base of a recess 2 are provided to the two opposed sides of the outer wall which surrounds the recess 2 of an insulating block body 1, and a wire is bonded to the upside of the groove 3. |
