发明名称 PREPARATION OF DATA ON PACKAGING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGING MACHINE
摘要 PURPOSE:To eliminate the trouble for correcting a set due to improper mounting of electronic components by re-generating parts arrangement data and NC data of an electronic component packaging machine by referring to the electronic components mounted to an electronic component supplying unit. CONSTITUTION:The information on electronic components mounted on an electronic component supplying unit 1 is input to the IC memory of a storage 12 which is mounted on the electronic component supplying unit 11 in advance and then component information is read by a reading device 13 for reading the information of the storage device 12. Information 16 on the arrangement of electronic components mounted on the electronic component supplying unit 11, component arrangement data 17 within an electronic component packaging machine, and NC data 18 are compared and verified and packaging is performed with the component arrangement data 17 and NC data 18 as they are if they are proper. When an error arises, component arrangement data 19 and NC data 20 are re-prepared and the packaging is performed in reference to the arrangement of electronic components mounted on the electronic component supply unit 11.
申请公布号 JPH0738282(A) 申请公布日期 1995.02.07
申请号 JP19930183127 申请日期 1993.07.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SEKINE MITSUHIRO;NONAKA SATOSHI;YOSHIDA IKUO
分类号 H05K13/00;H05K13/04;H05K13/08 主分类号 H05K13/00
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