| 摘要 |
PURPOSE:To have an excellent separability of a cull and a runner from a die even if such sealing resin as to have an excellent adhesion to the die is used and to accelerate hardening of the cull and the runner so as to cope with a shorter molding cycle. CONSTITUTION:Each resin-sealed semiconductor element assembled product 20 is molded into one body through a cull 24 and a runner 25. A take-out hand 10 for taking each resin-sealed semiconductor element assembled product out of a lower die 1 is provided with two nozzles to blow off compressed air against each cull 24. Before taking out the semiconductor element assembled products 20 with the take-out hand 10, compressed air is blown off against each cull 24 from each nozzle 11. Therefore, the culls 24 and the runners 25 are cooled and hardening of sealing resin is accelerated. |
