发明名称 |
Method for making a fillet for integrated circuit metal plug |
摘要 |
A well in a semiconductor wafer is partially filled by a tungsten plug having an irregular surface. There is an aluminum line exterior of the well for electrically connecting the tungsten plug into an electrical circuit. A doped polysilicon fillet having an irregular surface meshing with the irregular surface of the tungsten plug fills the portion of the well between the plug and line, making a reproducible good electrical connection between the tungsten plug and the aluminum line. The poly fillet is formed by a poly deposit and planarization performed between a tungsten plug overetch and aluminum line deposition.
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申请公布号 |
US5387550(A) |
申请公布日期 |
1995.02.07 |
申请号 |
US19920832349 |
申请日期 |
1992.02.07 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
CHEFFINGS, DAVID F.;ROBERTS, MARTIN C. |
分类号 |
H01L21/768;(IPC1-7):H01L21/44;H01L21/48 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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