| 摘要 |
PURPOSE: To completely seal an IC chip, etc., in a package, without increasing the entire standoff by mounting an IC device on one terminal of a backup cell and mounting the other terminal on base plate finger leads of a finger lead assembly. CONSTITUTION: Base plate support leads 28 are offset vertically so as to be not flush with the plane of a finger lead assembly 20, and a terminal 32p of a backup cell 32 is conductively adhered to the offset finger leads 28. A chip substrate 12 is adhered to a terminal 32N of the cell 32 through a conductive adhesive layer. Owing to such an offset structure, the backup cell 32 and IC chip 12 are disposed at the center in the vertical and length directions to the finger lead assembly in the package 30, without increasing the height of the package 30 or changing the socket regions or pin array. |
