| 摘要 |
PURPOSE:To provide a method for manufacturing a lead frame and the lead frame capable of eliminating the possibility of short-circuitting upon wire bonding without causing the high cost. CONSTITUTION:A lead frame includes a signalling inner lead 14, a common inner lead 12, and a takeout lead. The surface of the common inner lead 12 connected with a bonding wire 26 is formed to be lower than the inner lead 14 connected with the bonding wire 26. The manufacturing is such that in a process where a material is rolled into a predetermined thick plate material a band-shaped recess portion is previously formed in a plate material portion which will become the common inner lead in future longitudinally of the plate material, and in a one blanking (cutting) process the common inner lead 12 lower than other portions is formed.
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