发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to determine accurately the range of application of an insulating material and to make the insulating material thick sufficiently by forming a flow preventing groove for preventing flow of the insulating material. CONSTITUTION:A flow preventing groove 11 is formed in a lead frame. In a process of applying a varnish-like bonding agent for forming an insulating material 10, therefore, a sphere of application is determined by an edge 11a of the flow preventing groove 11, the possibility that the material flows to a wire-bonding part 2a is eliminated thereby and this can contribute to speedup of a process of application. Since the range of application is limited beforehand by the flow preventing groove 11 to a place necessitating the insulating material, besides, it is easy to make the insulating material 10 thick sufficiently and the reliability of the lead frame can be improved.
申请公布号 JPH0738044(A) 申请公布日期 1995.02.07
申请号 JP19930176603 申请日期 1993.07.16
申请人 HITACHI CABLE LTD 发明人 SUGIMOTO HIROSHI;SUZUMURA TAKASHI;KOYAMA HIDEYUKI;KAWAMURA TOSHIO
分类号 H01L21/60;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L21/60
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