发明名称 |
Metal-ceramic joint |
摘要 |
A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 mu m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 mu m.
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申请公布号 |
US5387441(A) |
申请公布日期 |
1995.02.07 |
申请号 |
US19920863129 |
申请日期 |
1992.04.03 |
申请人 |
HOECHST CERAMTEC AKTIENGESELLSCHAFT |
发明人 |
DO-THOI, THA;STINGL, PETER |
分类号 |
B23K1/20;B23K35/30;C04B37/02;C04B41/88;C04B41/90;(IPC1-7):B05D1/00;C25D7/00 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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