发明名称 Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
摘要 An ink fill slot can be precisely manufactured in a substrate utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots are appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead by means of an extended portion that results in a reduced shelf length and thus reduced fluid impedance imparted to the ink. The extended portion is precisely etched to controllably align it with other elements of the printhead.
申请公布号 US5387314(A) 申请公布日期 1995.02.07
申请号 US19930009151 申请日期 1993.01.25
申请人 HEWLETT-PACKARD COMPANY 发明人 BAUGHMAN, KIT C.;KAHN, JEFFREY A.;MCCLELLAND, PAUL H.;TRUEBA, KENNETH E.;TAPPON, ELLEN R.
分类号 B41J2/05;B41J2/14;B41J2/16;(IPC1-7):H01L21/306;B44C1/22;C03C15/00;B29C37/00 主分类号 B41J2/05
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