MANUFACTURE OF RESIN-SEALED ELECTRONIC CIRCUIT DEVICE

摘要

PURPOSE:To prevent a leakage of sealing resin by preventing formation of a gap by making a dam bar made of epoxy resin and a mold for resin sealing abut firmly on each other. CONSTITUTION:A semiconductor chip 4 is bonded on a mounting surface (island) in the center of a lead frame having a dam bar 3 formed and each electrode is connected to a lead 2. Next, a top force 6 and a bottom tool 7 are made to abut on the lead frame in accordance with an external line of prescribed sealing resin so that they hold the lead frame between them. On the occasion, the dam bar 3 in a part being about 0.1mm wide and protruding partially outside the external line of the sealing resin is crushed. Therefore the top force 6 and the bottom tool 7 abut firmly on the dam bar and formation of a gap is prevented. According to this constitution, a leakage of the sealing resin is prevented.