| 摘要 |
PURPOSE:To obtain a lead frame and a manufacture thereof which make it possible to use a semiconductor element of the same pad irrespective of the shape of a package. CONSTITUTION:In regard to a lead frame 1 wherein the number of outer leads 32 of a first lead group 30a corresponding to a side (a) of a die pad 2 is larger than the number of the outer leads 32 of a second lead group 30b corresponding to a side (b) perpendicular practically to the side (a), a manufacture of the lead frame 1 wherein fore ends of several inner leads 31 of the first lead group 30a are disposed in the vicinity of the side (b) and wherein a lifting lead is formed integrally in a state of being connected to the middle of one lead 3, then bonded to the lead 3 with the a nonconductive bonding member interposed, and thereafter cut from the lead 3. |
