| 摘要 |
PURPOSE:To enable the simple and easy prevention of troubles due to the con tact of adjacent bumps, by forming recesses outside the photoelectric converting region on a first semiconductor substrate, and forming projections to be fitted into the recesses, outside the signal processing region on a second semiconductor substrate. CONSTITUTION:Photodiode(s) 1a are formed in one- or two-dimensional arrangement on a first semiconductor substrate 2 to form a photoelectric converting region 1 where incident light is converted into current. Input diode(s) 5a are placed in one-or two-dimensional arrangement on a second semiconductor substrate 6 to form a signal processing region 5 where the signals converted in the photoelectric converting region are read. Recesses 4 or projections are formed in the area other than the photoelectric converting region 1 on the first semiconductor substrate 2. Projections 8 or recesses to be fitted onto/into the recesses 4 or projections, are formed in the area other than the signal processing region 5 on the second semiconductor substrate 6. This makes it possible to prevent horizontal displacement that might occur when bonding bumps by press. |
