发明名称 LEAD FORMING METHOD AND APPARATUS THEREFOR
摘要 PURPOSE:To provide a lead forming method and an apparatus for executing the method wherein an external lead extending from a package where deformation is produced is formed with higher flatness. CONSTITUTION:A lead forming apparatus comprises a work press portion 21 (upper mole (a) lower mold (b)) for fixing a lead extending from a package 11 vertically, a laser displacement meter 22 for measuring the vertical displacement of the lead 12, a lead chuck portion 23 (upper mold (a), lower mold (b)) for vertically chucking the tip end of the lead 12 and bending it into a desired shape, and a control portion 24 for estimating the amount of molding based upon data sent from the laser displacement meter 22 and hereby controlling the lead chuck portion 23. The laser displacement meter 22 measures the deformation state of the lead 12 and the control portion 24 groups the leads based upon the measured deformation state information such that differences among the heights of the leads falls within 10mum for example for molding of the leads for each group.
申请公布号 JPH0738030(A) 申请公布日期 1995.02.07
申请号 JP19930181025 申请日期 1993.07.22
申请人 TOSHIBA CORP 发明人 TSURUSHIMA KUNIAKI;TAURA NOBUHIKO
分类号 H01L23/50;H05K13/04 主分类号 H01L23/50
代理机构 代理人
主权项
地址