Wafer cutting device

摘要

A wafer cutting device has a plurality of individually highly tensioned diamond impregnated wires that are mounted in a translatable head. Each wire has a tension monitor connected thereto for the purpose of insuring uniform tension and also alerting to breakage. Further, a differential DC voltage is applied to the wires and the crystal with the assistance of electrolytes to improve the removal of material for minimizing damage to the surfaces. The crystal is mounted on a two dimensional stage. During normal cutting the crystal is moved vertically into the cutting wire. The vertical cutting rate is adjusted due to the configuration of the crystal. At the end of cutting, the crystal is moved laterally so as to place a notch in the wafers for the purpose of removing the wafer in a clean break.