MANUFACTURE OF CONDUCTIVE PASTE FOR VIA HOLE AND MALTILAYER CERAMIC SUBSTRATE USING THE CONDUCTIVE PASTE

摘要

PURPOSE:To provide a manufacturing method of a conductive paste for via hole and a multilayer ceramic substrate using this conductive paste which have a high continuety reliability. CONSTITUTION:This is a conductive paste for via hole in a multilayer ceramic substrate. The conductive paste consists of 75 to 95wt.% of Cu powder with the grain diameter scope 0.1 to 20mum, and the mean grain diameter 2 to 10mum; and 5 to 25wt.% of an organic vehicle; and the paste viscosity is in the scope 25 to 50Pa.s. After the above conductive paste is filled into the via holes of a ceramic green sheet, plural sheets of ceramic green sheets are laminated and baked.