| 摘要 |
<p>PURPOSE:To make it possible to form a highly accurate pattern and a fine line or pattern easily, by applying fluororesin dispersion to a roughly formed face of a metallic foil, and forming a resin layer on the metallic foil in drying and baking steps. CONSTITUTION:A board for a printed circuit includes a metallic copper foil 3 with a roughened face 1 and the other glossed face 2. At first the copper foil 3 is dipped in a container filled with a solution of fluororesin dispersion, and the copper foil 3 is passed through a space between opposite heaters. In this way, the fluororesin dispersion is applied to the roughened face 1 and the glossed face 2, and the foil 3 is dried and baked to form resin layers 4 and 5. Then, an electroless copper plating layer 7 is formed on a modified surface 4a of the resin layer 4. An electrolytic copper plating layer 8 as a metallic layer is formed on the surface of the electroless copper plating layer 7 to complete a double-sided board (B) for a printed circuit.</p> |
