| 摘要 |
<p>PURPOSE:To provide a semiconductor manufacturing device, which does not require labor for cutting and separation of a semiconductor wafer and is capable of lessening a reduction in the yield of the wafer at the time when the wafer is divided. CONSTITUTION:A semiconductor wafer 24 is formed in such a way that it is cut along the grooves 45 and is separated from a porous adsorbing material 33 by making the wafer 24, which is provided with the split grooves 45 carved therein in such a way as to follow the surface form of a recessed and curved surface-shaped suction surface 34 of the porous suction material 33, suck on the surface 34 by a suction mechanism 37. Owing to this, when the suction force of the mechanism 37 is properly set and the wafer 24 is sucked on the suction material 33, the wafer 24 is deformed in such a way as to bend in the parts of the grooves 45 of a thinly formed wall thickness and is deformed in such a way as to follow the surface form of the recessed and carved surface-shaped suction surface 34. By this deformation, the wafer 24 is cut along the grooves 45 and is separated from the material 33. As this result, the wafer 24 with the grooves 45 provided in such a way that the wafer can be split in a prescribed size is cut and separated without requiring labor and a reduction in the yield of the wafer at the time when the wafer is separated in the prescribed size can be lessened.</p> |
