| 摘要 |
PURPOSE:To materialize high integration by laying a plurality of chips, whose plane areas become small in order, on top of one another gradually with their surfaces upward, and enclosing them with one package. CONSTITUTION:Chips 1 and 2 are composed of integrated circuits, on the surface of which semiconductor elements are made, and pads 3 and 4. To begin with, the chip 1 is mounted in the chip mounting area 6 of a package 5 by conductor paste 7 including silver. Next, a chip 2, which has plane area such as that it may be on inner side than the pad 3 of the chip 1, is mounted by paste, with its surface 8 upward. Next, the pads 3 and 4 and terminals 9 are connected witch each other by thermocompression bonding with gold wires 10, respectively, and then the package is sealed. Since the upper chip is smaller in area than the lower chip, three or more chips can be enclosed with one package without enlarging the package. Moreover, the relation of connecting position between the pad of the chip and the terminal of the package may be optional, so there is an advantage such as that the freedom in design improves. |
