发明名称 FINE PROCESSING RESIST
摘要 PURPOSE:To form a fine pattern at high resolution on a surface of a substrate material and to transfer an arbitrary fine pattern freely to a material surface by arranging an oxide. film formation raw material by anodic oxidation in an outermost layer. CONSTITUTION:An oxide film formation material such as metal titanium or alloy thereof which can form an oxide film by anodic oxidation treatment is arranged on a second layer 2 as an outermost layer 1 of a multilayer structure of one or more layers. Then, a fine electrode 3 of a sharp tip is made proximate to a surface of the outermost layer 1, a voltage is applied using the fine electrode 3 as a negative electrode and the outermost layer 1 as a positive electrode and a pattern of a fine anodic oxide film 4 is formed in an outermost layer surface. Furthermore, the resist outermost layer 1 is etched by a proper method using the generated anodic oxide film 4 as a mask for fine processing of the outermost layer 1. A substrate or a resist second layer is finely processed using a fine pattern acquired in this way as a mask.
申请公布号 JPH0737790(A) 申请公布日期 1995.02.07
申请号 JP19930181448 申请日期 1993.07.22
申请人 RES DEV CORP OF JAPAN;SUGIMURA HIROYUKI 发明人 SUGIMURA HIROYUKI;UCHIDA TATSUYA
分类号 C23C14/04;B81B1/00;B81C1/00;B82B3/00;C25D11/00;G03F7/26;H01L21/027;(IPC1-7):H01L21/027 主分类号 C23C14/04
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