MANUFACTURE OF QUAD LEADFRAME FOR SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE BASED ON SUCH LEADFRAME

摘要

PURPOSE: To improve cost efficiency of manufacturing a CERAQUAD leadframe by utilizing the Al cladding with use of dual in-line lead frames. CONSTITUTION: This lead frame 10 is provided with two opposed side rails 12, leads 14 which are connected to the rails 12 and have a metal clad layer 16 on the top ends of the leads 14 distant from the side rails 12 and separate two opposed side rails 18 which are not connected to any lead 14 and have a metal clad layer 20 for cladding. Two lead frames 10 are stacked one above the other, so that the leads of one lead frame cross those of the other lead frame, thereby making both lead frames tack-weldable at desired position along the side rails 12.