SEMICONDUCTOR INNER LEAD BONDING TOOL

摘要

A bonding tool (20) for bonding inner leads (58, 60, 62, 64) to semiconductor chips (50) is arranged to capture and align elongated lead sections (58, 60, 62, 64) extending in any one of plural direction, and preferably, in any one of two mutually orthogonal directions (26, 28). Thus, the tool (20) can be applied to align and bond all of the leads (58, 60, 62, 64) to a chip (50) without turning the tool (20) or the chip (50) even where the leads (58, 60, 62, 64) extend in multiple directions.