| 摘要 |
Methods and apparatus for providing high and uniform processing rates for electroplating, deplating, etching and the like, substantially independent of the surface geometries of the article subjected to the process. In an electroplating application, the article to be plated is supported on a cathode so the electrolyte may be forcibly sprayed on the article from an array of spray nozzles adjacent the surface thereof. Intermixed with the array of spray nozzles may be a second array of openings providing suction to locally remove most of the sprayed electrolyte after impingment on the work piece. In this manner most of the spent electrolyte is removed from the work piece locally so that it is not available to flow down the work piece to shield the surface thereof from the spray of lower nozzles. One or more additional intermixed arrays of delivery ports may also be used to deliver such things as inert gases, brighteners, polishing media, air under pressure to increase agitation, etc., either on a continuous basis or on an intermittent basis as desired. Uniformity over the work piece area is assured by random oscillation of the work piece in an amount on the order of the nozzle spacing. The methods and apparatus are applicable to other electrical processes such as deplating, and non-electrical processes such as etching and cleaning.
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