A semiconductor device with improved heat dissipation.

摘要

A semiconductor device having improved heat dissipating capability is provided. The preferred device in accordance with the invention includes an electronic device (12) formed in a surface (14) of a semiconductor die (10). The surface (14) is covered with a layer of diamond (20). Openings (24) are provided in the diamond layer (20) for access to the electronic device. A metallized pad (26) is provided on top of the diamond layer (20). Additionally, solder bumps (28) pass through the openings (24) in the diamond layer (20). A die attach substrate (32) is attached to the metallized pad (26) and the bumps (28). Heat is dissipated uniformly across the diamond layer (20) and is drawn off the device through the metallized pad (26). Electrical connections are made to the device via the solder bumps (28).