| 发明名称 |
Heat resistant adhesive composition and bonding method using the same. |
| 摘要 |
<p>A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.</p> |
| 申请公布号 |
EP0389951(B1) |
申请公布日期 |
1995.02.01 |
| 申请号 |
EP19900105355 |
申请日期 |
1990.03.21 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
SATOU, EIKICHI;IMAIZUMI, JUNICHI;NOMURA, HIROSHI;NAGAO, KOUICHI;SUZUKI, MASAKATSU;SAKAIRI, KOUSHI |
| 分类号 |
B32B7/12;C08G73/12;C08L79/08;H01B3/30;H05K1/00;H05K1/03;H05K3/28;H05K3/38;H05K3/46;(IPC1-7):C09J179/08;C08J5/12 |
主分类号 |
B32B7/12 |
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| 主权项 |
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