| 摘要 |
A printed circuit board in the farm of an integral strip-line structure comprises two spaced apart conducting ribbons 7 having therebetween a layer of stiff dielectric material 13 flanked on opposite sides with respective layers 17 of curable dielectric material on the outermost surfaces of which the ribbons are respectively mounted. Respective further layers 3, 5 of stiff dielectric material are provided on the outermost surfaces of the layers of curable material, conductive tracks 11 being supported on the stiff dielectric and/or curable layers 3, 5, 13, 15 or 17 and spaced laterally from the ribbons. Further provided are ground plates 9 disposed on the outermost surfaces respectively of the further layers 3, 5 and facing the ribbons. Heat and pressure is applied to the structure to cure the curable layers. The structure enables connection together of the ribbons exclusively at corresponding ends which simplifies calculation of the characteristic impedance of the structure. <IMAGE> |
