发明名称 COMPOUND SEMICONDUCTOR DEVICE AND ITS MANUFACTURING EQUIPMENT
摘要 PURPOSE:To obtain excellent ohmic contact in a P-type wide gap II-VI compound semiconductor, by mixing a lot of nitrogen atoms in a contact layer whose main component is P-type II-VI wide gap compound semiconductor. CONSTITUTION:On compound semiconductor substrates 21-24 whose surface is at least composed of P-type II-VI wide gap compound semiconductor 24 such as ZnSe, ZnSSe, ZnS, ZnMgSe and ZnMgSSe, a contact layer 25 whose main component is P-type II-VI wide gap compound semiconductor is formed in order to obtain ohmic contact, and an ohmic electrode 26 is formed via the contact layer 25. In the above compound semiconductor, a lot of nitrogen atoms are mixed in the contact layer 25. For example, nitrogen atoms of 1X10<20>cm<-3> or more are mixed in the contact layer 25, and the thickness of the contact layer 25 is set to be 10nm or smaller.
申请公布号 JPH0729924(A) 申请公布日期 1995.01.31
申请号 JP19930171659 申请日期 1993.07.12
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAMADA TAKASHI;YAMASHITA MASASHI
分类号 H01L21/28;H01L21/283;H01L21/441;H01L33/28;H01L33/30;H01L33/40 主分类号 H01L21/28
代理机构 代理人
主权项
地址
您可能感兴趣的专利