| 摘要 |
PURPOSE:To provide a high frequency element capable of forming a matching circuit without increasing a semiconductor element in chip area and number of manufacturing processes. CONSTITUTION:In a high frequency element package 7, cutouts are provided to the end of a metal comb 1a, whereby a thin band smaller than the metal comb 1a in width is formed as a coil 2, and a rectangular part wider than the thin band is formed as one of the electrodes of a capacitor 3. The capacitor 3 is composed of the one electrode of the rectangular part, the other electrode formed of a part of the source of a metal comb 1b, and a dielectric body 6 provided between the electrodes. A matching circuit which matches a semiconductor element 4 with an external circuit in input and output is composed of the coil 2 and the capacitor 3. |
