发明名称 |
Leadframe having one or more power/ground planes without vias |
摘要 |
Power and ground connections are provided using or more conductive layers provided in an integrated-circuit package design. A leadframe has either a tape assembly or a heat-conducting dielectric ceramic substrate attached to the die-attach paddle of the leadframe and one or more conductive planes are formed on the top surface of the tape assembly or the ceramic substrate. The tape assembly includes a conductive metal layer, a polyimide layer, and an adhesive layer. The metal layer on the tape or ceramic substrate and the metal die-attach pad of the leadframe are used as low inductance power planes providing connections to the integrated-circuit. No vias are used. Use of a metal die-attach paddle for the leadframe is optional when a ceramic substrate is used.
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申请公布号 |
US5386141(A) |
申请公布日期 |
1995.01.31 |
申请号 |
US19920860810 |
申请日期 |
1992.03.31 |
申请人 |
VLSI TECHNOLOGY, INC. |
发明人 |
LIANG, LOUIS H.;WANG, TSING-CHOW |
分类号 |
H01L23/12;H01L23/495;H01L23/50;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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