| 发明名称 |
Semiconductor device having groups of pads which receive the same signal |
| 摘要 |
A semiconductor device comprises a bonding pad serving as a power supply terminal and a plurality of bonding pads having the same function and serving as one of grouped terminals other than the power supply terminal.
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| 申请公布号 |
US5386127(A) |
申请公布日期 |
1995.01.31 |
| 申请号 |
US19940248536 |
申请日期 |
1994.05.24 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
FURUYAMA, TOHRU |
| 分类号 |
H01L21/66;G11C5/00;H01L21/822;H01L27/04;(IPC1-7):H01L27/02 |
主分类号 |
H01L21/66 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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