| 摘要 |
PURPOSE:To detach a defective chip and reliably mount a new chip, in an electronic device wherein a semiconductor chip or the like is mounted on a substrate and the chip or the like is connected with the substrate by wire bonding. CONSTITUTION:Wires 30 are cut at the neck parts 31 of the wires and a chip 20 is removed from a substrate 10. Wire residue left on substrate side pads 11 is so machined that the upper surface is made flat. The surface of wire residue 33 and the substrate side pads 11 are irradiated with a laser beam 41 and cleaned. A new chip is fixed on the substrate 10 and the pads of the new chip and the substrate side pads 11 wherein flattened wire residue 33 is left are connected by using new wires. |
