| 摘要 |
<p>PURPOSE:To easily recognize an image of every element when the element is picked up by a method wherein an adhesive for fixation of a semiconductor wafer is provided with a photopolymerizing carbon-carbon double bond in a moelcule and a specific characteristic value, and contains a polyisocyanate, a melamine resin or an epoxy resin. CONSTITUTION:An adhesive tape for fixation of a semiconductor wafer is obtained in such a way that an adhesive layer composed of a prescribed adhesive is formed on a radiation-transmitting substrate. The adhesive which is used here contains, as main components, 100 pts.wt. of a compound having photopolymerizing carbon-carbon double bond in a molecule at an iodine value of 0.5 to 20, at a hydroxy value of 5 to 100, at an acid value of 0.5 to 30 and at a molecular weight of 10000 to 220000 and 0.1 to 10 pts.wt. of at least one kind selected from polyisocyanates, a melamine formaldehyde resin and an epoxy resin.</p> |
