发明名称 MULTILAYER PRINTED WIRING BOARD AND ADHESIVE SHEET
摘要 PURPOSE:To provide a multilayer printed wiring board and a adhesive sheet where the peal strength and the reliability on insulation can be improved by performing the depth control of a recess for an anchor easily and securely. CONSTITUTION:This multilayer printed wiring board 7 is equipped with an adhesive layer 2a arranged on the side of an inner layer board 1 and an adhesive layer 2b for additive arranged on this adhesive layer 2a. The adhesive layer 2a is refractory in specified roughening liquid. Two kinds of soluble filters F1 and F2 different in average diameter are added into the resin matrix M of the adhesive layer 2b for active. The thickness T of the adhesive layer 2b for active is one and 4 half to three times as large as the average diameter (r) of one large in average diameter between the fillers F1 and F2.
申请公布号 JPH0730259(A) 申请公布日期 1995.01.31
申请号 JP19930168039 申请日期 1993.07.07
申请人 IBIDEN CO LTD 发明人 FURUKAWA KAZUHIRO
分类号 H05K3/38;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/38
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