| 摘要 |
<p>PURPOSE:To enable a thermal stress generated between a die pad and a tab suspension lead to be dissipated by a method wherein a semiconductor device lead frame is manufactured making a die pad and a tab suspension lead be separately formed, and then the die pad and the tab suspension lead are so joined together by a fastener as to be enough in degree of freedom. CONSTITUTION:Only a frame of a lead frame 1 without a die pad is formed, and a die pad 3 corresponding to the tie pad of the lead frame 1 is formed. Then, a tab suspension lead 4 and the die pad 3 are joined together by fasteners 13 and 16 as to be enough in degree of freedom. The die pad 3 and the tab suspension lead 4 are made to so overlap each other as to make the die pad 3 positioned under the tab suspension lead 4, and the screw 13 as a fastener is put through both a through-hole 14 provided to the tab suspension lead 4 and a through-hole 15 bored in the die pad 3, driven into a nut 16, and fixed by tightening. By this setup, a stress generated by thermal expansion or shrinkage can be prevented from occurring, so that a semiconductor device can be lessened in fraction defective.</p> |
