| 摘要 |
PURPOSE:To provide a multilayered ceramic substrate with a close spacing of bump electrodes, which can be mounted on a motherboard at a given height. CONSTITUTION:A multilayered ceramic substrate includes via conductors 2, each connected with a bump that is formed, directly above the conductor, of a metallic core electrode 3 having a higher melting point than solder. The bump has a solder coating 4, and if necessary, it may have a gold plating 5 on the solder coating. |
