| 摘要 |
PURPOSE:To enable an LSI package used in the field of personal computers and computer systems to be enhanced in degree of integration by a method wherein lead frames are arranged high in density. CONSTITUTION:In an LSI package wherein lead frames 1 are arranged in parallel extending from the side of a package body 5, the lead 2 of the lead frame 1 extending from the package body 5 as exposed is formed into a triangular shape whose tip is pointed, and the lead frames 1 are alternately arranged so as to alternately dispose triangles (leads 2 of one frame 1) and inverted triangles (leads 2 of adjacent frame 1) side by side at the side beta of the package body 5. |
