ADHESIVE TAPE FOR DICING OF SEMICONDUCTOR WAFER

摘要

PURPOSE:To provide an adhesive tape, for fixation of a semiconductor wafer, which is used when the semiconductor wafer is cut and divided into semiconductor elements and which can pick up the semiconductor elements easily by recognizing an image. CONSTITUTION:An adhesive tape for fixation of a semiconductor wafer is formed in such a way that an adhesive layer is formed on a radiation- transmitting substrate. In the adhesive tape for dicing of the semiconductor wafer, an adhesive which is coated as the adhesive layer contains as main components 100 pts.wt. of a compound (A) whose glass transition point is at -7 to -35 deg.C and having a photopolymerizing carbon-carbon double bond at an iodine value of 0.5 to 20 in a molecule and 0.1 to 10 pts.wt. of at least one kind (B) selected from polyisocyanates, a melamine formaldehyde resin and an epoxy resin.