| 摘要 |
PURPOSE:To provide a printed-circuit board, free from haloing or locally reddened areas, by reducing a copper oxide film on an inner circuit layer of the board in a gaseous atmosphere, and oxidizing the reduced film to a specific extent in a gaseous atmosphere to form a thin copper oxide film. CONSTITUTION:A process of producing a laminate for a printed-circuit board comprises the steps of integrally laminating one or more inner circuit layers, prepregs, and copper foil or outer conductor layer such as a one-sided copper- clad plate; drilling for through holes; de-smearing; plating; and forming outer circuits. In this process, a copper oxide film is formed on the copper foil of the inner circuit layer, and the copper oxide film is reduced to a degree of reduction of 62-100%. The reduced film is oxidized again to a degree of reduction of 60-93% to form a thin copper oxide film. The degree of reduction is defined as follows, where the oxygen content is measured by x-ray fluorescent analysis or acid dissolution. degree of reduction (%)=[1-(oxygen content in copper oxide after reduction or oxidation divided by oxygen content in copper oxide before reduction]X100. |
