发明名称 MULTILAYERED CERAMIC WIRING BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE:To obtain smooth cut edges of a green sheet having interconnection patterns, even if they are along snap lines, by providing dummy patterns opposite the snap lines on the surface of the green sheet. CONSTITUTION:Green sheets 20 have wiring patterns 2 on their surfaces, and dummy patterns 22 are formed opposite the wiring patterns across snap lines on one or both of the green sheets. Accordingly, there is a smaller difference in thickness between the areas of the wiring patterns and the areas opposite the wiring patterns across snap lines on the green sheets. When the green sheets are sintered, the irregularities in internal density of the sintered laminate is minimized. As a result, the cut edges of the laminate become smooth if it is cut along snap lines.
申请公布号 JPH0730251(A) 申请公布日期 1995.01.31
申请号 JP19920065383 申请日期 1992.03.23
申请人 NGK INSULATORS LTD;N G K ELECTRON KK 发明人 OHARA MINORU;HASEGAWA ISAMU
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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