发明名称 High isolation microwave module
摘要 A high isolation microwave module includes a housing floor with mounting surfaces for placing microwave components and housing walls ending in housing wall ends coupled to and projecting from the housing floor. A lid including a lid plate and lid walls ending in lid wall ends projects from the lid plate. The lid walls extend toward the housing floor and the plurality of housing walls extend toward the lid plate but neither the lid wall ends nor the housing wall ends are coupled to the housing floor or lid plate, respectively. A plurality of cavities exist between the adjacent lid walls between the housing and the lid plate and a plurality of irises exist between immediately adjacent housing walls and corresponding lid walls. The irises and cavities act as a multi-section high pass filter to provide attenuation to a microwave signal passing through the module.
申请公布号 US5386204(A) 申请公布日期 1995.01.31
申请号 US19930101165 申请日期 1993.08.03
申请人 MOTOROLA, INC. 发明人 SEELY, WARREN L.;KAO, JOSEPH H.;FLEMING, JAMES H.
分类号 H01P1/20;H05K9/00;(IPC1-7):H01P1/208 主分类号 H01P1/20
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