发明名称 |
High performance substrate, electronic package and integrated circuit cooling process |
摘要 |
Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the porous ceramic body (14). A heat transfer liquid (18) partially fills pores (30) of the porous ceramic body (14). A plurality of integrated circuit chips (20) are attached to a surface of the substrate (12) by epoxy, solder or other bonds (22). On an opposite surface, the substrate (12) includes a plurality of heat transfer fins (24). In use, the heat transfer liquid (18) in the ceramic body (14) is vaporized to fill the balance of the pores (30) and condensed in a continuous heat pipe cycle to remove heat from the integrated circuits (20) mounted on the substrate.
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申请公布号 |
US5386143(A) |
申请公布日期 |
1995.01.31 |
申请号 |
US19930130151 |
申请日期 |
1993.09.30 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
FITCH, JOHN S. |
分类号 |
H01L23/427;(IPC1-7):H01L25/04 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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