Printed circuit board having U-shaped solder mask layer separating respective contacts

摘要

A circuit pattern layer is formed over the surface of a laminated board such that it includes one array of solder pads. The circuit pattern layer has its surface covered with a solder mask layer. The solder mask layer has a U-shaped recess at the area of the solder pad. The solder pad is exposed at the area of the U-shaped recess. Upon the soldering of the connector's connection terminal to the solder pad at the area of the U-shaped recess, a molten solder is kept in the U-shaped recess and prevented from flowing onto the adjacent connection terminal. It is thus possible to prevent a solder bridge from being created across those connection terminals.