| 摘要 |
<p>PURPOSE:To prevent disconnection of a substrate wiring arranged just under a semiconductor chip, when stress is caused by the difference of thermal expansion coefficient between the semiconductor chip and a board mounted with it. CONSTITUTION:In the title semiconductor device, a substrate 1 is basically constituted of a plurality of electrode parts 3 which are electrically and physically connected with terminals of a semiconductor chip 2 mounted on the substrate, and wiring which is led out from the electrode parts 3. A substrate wiring just under the semiconductor chip 2 is formed through the led-out wiring. The led-out wiring from each electrode part 3 is arranged on the distant side of the electrode part 3 from the center of a mounted semiconductor chip 2, preferably on the extension of a straight line connecting the center of each electrode part with the center of the semiconductor chip 2.</p> |
