| 摘要 |
<p>PURPOSE:To prevent a semiconductor device from being defectively mounted on a board by a method wherein the tips of leads of a flat package or a single- out-line package provided with gull-wing outer leads are subjected to tinning. CONSTITUTION:When a lead 2 is so processed as to make plating solder adhere to an A part of the lead 2, a cut 4 is provided to the A part by etching when an etching frame is used or by pressing when a press frame is used. As a result, tinning 3 can be made to adhere to the A part. Therefore, when a check operation to see if the lead 2 is rising or not or a positioning operation is carried out recognizing the tip of the lead 2, a recognition failure can be prevented, and a semiconductor device can be prevented from being defectively mounted.</p> |
